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SOLDERING APPLICATION NOTESTECHNICAL NOTES52www.SunLEDusa.comSOLDERING INSTRUCTIONSCleaning1. Do not use harsh organic solvents such as acetone, trichloroethylene, Chlorsan, and/or diflon solvent for cleaning as they may cause damage or hazing to the LED lens.2. Do not use acidic solvents or unknown chemicals for cleaning as they may damage or degrade the LED. Always check the properties of the chemical to ensure it will not corrode or damage epoxy resin, silicone resin, silver plating, or organosilicates.3. Recommended solvents for cleaning: deionized water or isopropyl alcohol.4. Special attention should be taken if other chemicals are used for cleaning as they may damage the epoxy lens or housing.5. Any cleaning should take place at room temperature and the wash duration should not exceed one minute.6. Use forced-air drying immediately following water wash to remove excess moisture.The technical notes in this catalog are subject to change without notice.8. After soldering, allow at least three minutes for the component to cool to room temperature before further processing.9. Refer to below table for summary of soldering instructions for dip, wave, and manual solder. Note that these are considered general instructions and all soldering notes indicated above should take precedence.TypesDip soldering / *Wave SolderingIron soldering (with 1.5mm iron tip)Temperature of the soldering bathMaximum soldering timeDistance from solder joint to packageTemperature of soldering ironMaximum soldering timeDistance from solder joint to packageLEDs<=260°C3s>=2mm<=350°C3s>2mm<=260°C5s>=5mm<=350°C5s>5mmSMDs///<=350°C3s (one time only)/DISPLAYs*<=260°C*3s*>2mm<=350°C3s>2mmAPPLICATION NOTES7. Refer to the appropriate product datasheet for details on specific soldering pay layout. To ensure proper bonding and setting of the LED, solder paste must be evenly applied to each soldering pad. Refer to below diagram (Fig. 7) for example of improper solder application.Lead Forming1. Any lead forming or bending must be done prior to soldering.2. Avoid bending leads at the same point more than once as it may compromise the integrity of the leads.3. Minimum clearance of 3mm is required between the base of the LED lens and the bend location. Refer to below diagram (Fig. 8).Fig. 7Uneven Solder Paste